Users of this publication are encouraged to participate in the development of future revisions. Tel December Table of Contents. Document Hierarchy.
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Users of this publication are encouraged to participate in the development of future revisions. Tel December Table of Contents.
Document Hierarchy. Definition of Terms. Classification of Products. Printed Board Type. Revision Level Changes. Underwriters Laboratories. Performance Requirements.
Material Selection. Epoxy Laminates. High Temperature Laminates. Special Clad Materials. Other Laminates.
Laminate Materials. Measurement of Dielectric Thickness. Laminate Properties. Single-Clad Laminates. Double-Clad Laminates. Laminate Material Code Designation. Conductive Materials. Organic Protective Coatings. Markings and Legends.
Fabrication Requirements. Printed Board Geometries. Mechanical Support. Design Requirements for Printed Board Assembly. Assembly, Palletization and Test. Dimensioning Systems. Profiles, Cutouts and Notches. Printed Board Thickness Tolerance. General Attachment Requirements. Printed Board Extractors. General Requirements for Lands with Holes.
Land Requirements. Thermal Relief in Conductor Planes. Clearance Area in Planes. Nonfunctional Lands. Conductive Pattern Feature Location Tolerance. Unsupported Holes. Conductor Characteristics. Edge Spacing. Balanced Conductors. Flush Conductors for Rotating or Sliding Contacts.
Land Characteristics. Offset Lands. Large Conductive Areas. Filled Holes. Nonfunctional Holes. Figure 4—1. Dielectric Layer Thickness Measurement.
Figure 4—2. Figure 5—1. Borders and Margins in Printed Board Panels, mm [in]. Figure 5—2. Scoring Parameters. Figure 5—3. Conductor Clearance for V-Groove Scoring. Figure 5—4. Breakaway Tabs. Figure 5—5. Breakaway Routed Pattern with Routed Slots. Figure 5—6. Routed Slots. Figure 8—1. Permanent Printed Board Extractor. Figure External Printed Board Extractor.
Figure 9—1. Figure 9—2. Foil Web Size. Figure 9—3. Lead-to-hole Clearance. Figure 10—1 Typical Flush Circuit. Figure 10—2 Surface Flushness Conditions. Table 4—1. Table 4—2. Advantages and Disadvantages of some Common Laminate Materials.
Table 4—3. Table Laminate Construction Selection Guide. Selection Guide. Polyimide Copper Clad Laminate. Construction Selection Guide. Table 5—1. Table 5—2. Tolerance of Profiles, Cutouts, Notches, and. Keying Slots, as Machined, mm [in].
Table 9—1. Pad to Plane Clearance, mm [in]. Table 9—2. Nonfunctional Land Considerations. Table 9—3. Feature Location Tolerances Lands,. Conductor Pattern, etc. Diameter True Position , mm [in]. Table 9—4. Diameter Tolerance Range for Unsupported Holes, mm [in].
IPC-2222A: Sectional Design Standard for Rigid Organic Printed Boards
IPC establishes the specific requirements for the design of rigid organic printed boards and other forms of component mounting and interconnecting structures. This standard applies to singlesided, double-sided or multi-layered boards. Revision A provides new design guidance and requirements for dielectric spacing, lead-free laminate materials, scoring and routing parameters, printed board thickness tolerance, nonfunctional lands, hole aspect ratios and clearance areas in planes. Your Alert Profile lists the documents that will be monitored. If the document is revised or amended, you will be notified by email.