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Dt Sheet. This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched. Device mounted on an epoxy-glass printed-circuit board, 1. Switched mode application. Maximum average forward current as a function of tie-point temperature including losses due to reverse leakage. MBD 2. Device mounted as shown in Fig. Maximum average forward current as a function of ambient temperature including losses due to reverse leakage.
Dimensions in mm. DUT handbook, full pagewidth Fig. The marking band indicates the cathode. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
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BYM26E Philips Semiconductors, BYM26E Datasheet
BYM26E Datasheet PDF